MCQ
India Semiconductor Mission MCQ - Practice Questions with Answers
Solve 48 India Semiconductor Mission questions for RAS/RPSC preparation.
Practice questions
Q1With reference to ISM’s design and supply-chain objectives, consider the following statements: 1. One objective is formulation of a long-term strategy for semiconductor and display manufacturing facilities and semiconductor design ecosystem in consultation with government, industry and academia. 2. ISM’s supply-chain objective includes facilitating trusted electronics through secure semiconductor and display supply chains, including raw materials, specialty chemicals, gases and manufacturing equipment. 3. ISM’s design-and-start-up objective includes support such as Electronic Design Automation tools and foundry services for early-stage start-ups. 4. ISM’s official objectives exclude collaboration with international agencies, industries and institutions. Which of the statements given above are correct?
Statements 1, 2 and 3 are correct and track ISM’s stated objectives on strategy, trusted supply chains, and design/start-up support. Statement 4 is false because ISM explicitly includes collaborations and partnership programmes with national and international agencies, industries and institutions.
Q2With reference to the institutional design of the India Semiconductor Mission, consider the following statements: 1. ISM has been set up as an Independent Business Division within Digital India Corporation. 2. ISM is a statutory regulator under MeitY without administrative and financial autonomy. 3. ISM is the nodal agency for efficient, coherent and smooth implementation of the Semicon India Programme. 4. The Semicon India Programme consists only of the Design Linked Incentive scheme. Which of the statements given above are correct?
Statement 1 is correct because ISM is an Independent Business Division within Digital India Corporation. Statement 2 is incorrect because ISM has administrative and financial autonomy; it is not a statutory regulator without autonomy. Statement 3 is correct because ISM serves as the programme's nodal agency. Statement 4 is incorrect because the programme has four schemes, not only DLI.
Q3With reference to Tata Electronics' semiconductor fab approved under India Semiconductor Mission, consider the following statements: 1. It is being set up in partnership with Powerchip Semiconductor Manufacturing Corp of Taiwan. 2. Its approved investment is Rs. 27,000 crore. 3. Its capacity is 50,000 wafer starts per month. Which of the statements given above are correct?
Statements 1 and 3 are correct. The fab is a Tata Electronics-PSMC partnership with 50,000 wafer starts per month capacity. Statement 2 is false; the investment stated for the Dholera fab is Rs. 91,000 crore, while Rs. 27,000 crore relates to the TSAT Assam unit.
Q4With reference to the advanced 3D semiconductor packaging unit announced for Odisha on 19 April 2026, consider the following statements:\n1. It is being executed by Heterogeneous Integration Packaging Solutions Pvt Ltd (HIPSPL), the wholly owned Indian subsidiary of US-based 3D Glass Solutions Inc.\n2. Its end uses will include data centres, AI/ML, 5G/6G communications, automotive radar, defence electronics, aerospace and photonics.\nWhich of the statements given above is/are correct?
Both statements are correct. Statement 1 accurately identifies the executing entity — HIPSPL, the wholly owned Indian subsidiary of US-based 3D Glass Solutions Inc. Statement 2 accurately lists the end-use sectors notified by MeitY, which include data centres, AI/ML, 5G/6G, automotive radar, defence electronics, aerospace and photonics. Therefore the correct option is "Both 1 and 2" — answer B.
Q5With reference to the Programme for Development of Semiconductors and Display Manufacturing Ecosystem in India, consider the following statements: 1. It was notified on 21 December 2021 with a total outlay of Rs. 76,000 crore. 2. India Semiconductor Mission was envisaged as a specialized and independent body to act as the nodal agency for implementation of semiconductor and display ecosystem schemes. 3. The programme originally excluded semiconductor design companies from its incentive architecture. Which of the statements given above are correct?
Statements 1 and 2 are correct. The programme was notified on 21 December 2021 with an outlay of Rs. 76,000 crore, and ISM was set up as the specialized nodal agency. Statement 3 is false because semiconductor design was explicitly included through the Design Linked Incentive component.
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6With reference to the Semicon India Programme, consider the following statements: 1. It was approved with an outlay of INR 760 billion. 2. The approval date mentioned by PIB is December 15, 2021. 3. The programme is meant for a sustainable semiconductor and display manufacturing ecosystem in India. Which of the statements given above are correct?
7Consider the following statements: 1. The HIPSPL Odisha unit's end-use sectors include data centres, AI/ML and 5G/6G communications. 2. The HIPSPL Odisha unit's end-use sectors include automotive radar, defence electronics, aerospace and photonics. 3. The HIPSPL Odisha unit is described in the corpus as India's first advanced 3D semiconductor packaging unit. 4. The HIPSPL Odisha unit is a coal gasification project unrelated to semiconductor packaging. Which of the statements given above are correct?
8Consider the following statements: 1. Crystal Matrix Limited will establish an integrated facility for compound semiconductor fabrication and ATMP in Dholera, Gujarat. 2. Its annual proposed production capacity for Mini/Micro-LED display panels is 72,000 square metres. 3. Crystal Matrix Limited's facility is an OSAT facility in Surat for manufacturing discrete semiconductors. Which of the statements given above are correct?
9With reference to the original approval of the Programme for Development of Semiconductors and Display Manufacturing Ecosystem in India, consider the following statements: 1. The programme was approved by the Union Cabinet on 15 December 2021. 2. Its approved outlay was Rs. 76,000 crore. 3. India Semiconductor Mission was designed to function as the nodal agency for the schemes on semiconductors and display ecosystem. 4. The programme excluded semiconductor design companies from its incentive architecture. Which of the statements given above are correct?
10With reference to the institutional design of the India Semiconductor Mission, consider the following statements: 1. It has been set up as an Independent Business Division within Digital India Corporation. 2. It has administrative and financial autonomy to formulate and drive India's long-term semiconductor and display strategies. 3. It is a statutory regulator established under the Ministry of Commerce and Industry. Which of the statements given above are correct?
11Consider the following statements: 1. The Design Linked Incentive Scheme covers semiconductor designs for Integrated Circuits, Chipsets, System on Chips, Systems and IP Cores. 2. C-DAC is the nodal agency of the Design Linked Incentive Scheme. 3. The Design Linked Incentive Scheme is meant for setting up semiconductor fabs and display fabs, not for design infrastructure support. Which of the statements given above are correct?
12With reference to the institutional design of the India Semiconductor Mission, consider the following statements: 1. The Union Cabinet approved the comprehensive semiconductor and display ecosystem programme on 15 December 2021. 2. The programme was approved with an outlay of Rs. 76,000 crore. 3. India Semiconductor Mission was designed as a state-level nodal agency under the Government of Gujarat. 4. The mission was intended to be led only by serving civil servants, not by global experts from the semiconductor and display industry. Which of the statements given above are correct?
13Consider the following statements: 1. The semiconductor programme covers silicon semiconductor fabs, display fabs, compound semiconductors, silicon photonics, sensors, ATMP/OSAT and semiconductor design. 2. Semiconductor design is a part of the incentive architecture under the programme. 3. India Semiconductor Mission is led only by state-government officials and excludes global experts from the semiconductor and display industry. Which of the statements given above are correct?
14Consider the following statements: 1. 3D Glass Solutions Inc. was approved to set up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneswar, Odisha. 2. The 3D Glass unit includes advanced technologies such as glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration modules. 3. The planned capacity includes approximately 69,600 glass panel substrates, 50 million assembled units and 13,200 3DHI modules per annum. 4. The 3D Glass unit is designed only for textile machinery and has no stated application in defence, high-performance computing or artificial intelligence. Which of the statements given above are correct?
15With reference to the HCL-Foxconn semiconductor unit in Uttar Pradesh, consider the following statements: 1. It was approved as the tenth semiconductor unit under India Semiconductor Mission. 2. It will manufacture display driver chips only for defence radars. 3. Its design output capacity is 36 million units per year. Which of the statements given above are correct?