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Electronics Manufacturing MCQ - Practice Questions with Answers

Solve 78 Electronics Manufacturing questions for RAS/RPSC preparation.

Practice questions

Q11. A PIB release states that technology nodes of 45 nm and above have high demand. 2. The demand for 45 nm and above nodes is driven only by smartphone applications. 3. The same release links this demand to automotive, power and telecom applications. Which of the statements given above are correct?

A 1 and 2 only
B 2 only
C 1 and 3 only
D 1, 2 and 3
Explanation

Statements 1 and 3 are correct: the 2022 PIB release says 45 nm and above nodes have high demand and links it to automotive, power and telecom applications. Statement 2 is false because the source does not restrict demand to smartphones.

Q2Consider the following statements about the Semicon India Programme: 1. It has a total outlay of INR 76,000 crore for developing the semiconductor and display manufacturing ecosystem. 2. The modified semiconductor-fab scheme extends fiscal support of 50% of project cost on a pari-passu basis. 3. The programme excludes display fabs from financial support. Which of the statements given above are correct?

A 1 and 2 only
B 2 only
C 3 only
D 1 and 3 only
Explanation

Statements 1 and 2 are correct: the programme outlay is INR 76,000 crore and the semiconductor-fab scheme provides 50% project-cost support. Statement 3 is false because the modified display-fab scheme also extends 50% support.

Q31. 3D Glass Solutions is to set up a vertically integrated advanced packaging and embedded glass substrate unit in Odisha. 2. The 3D Glass unit includes technologies such as glass interposers with passives and silicon bridges. 3. The 3D Glass unit is located in Punjab. Which of the statements given above are correct?

A 1 and 2 only
B 2 and 3 only
C 1 and 3 only
D 1, 2 and 3
Explanation

Statements 1 and 2 are correct. Statement 3 is false because the 3D Glass unit is in Odisha; CDIL is the project located in Punjab.

Q4Consider the following statements: 1. The EMC 2.0 Scheme was notified on 1st April, 2020. 2. A Common Facility Centre under EMC 2.0 focuses on upgrading common technical infrastructure for existing ESDM units. 3. The cost of land is eligible for financial assistance under EMC 2.0. Which of the statements given above are correct?

A 1 only
B 1 and 2 only
C 2 and 3 only
D 1, 2 and 3
Explanation

Statements 1 and 2 are correct: EMC 2.0 was notified on 1 April 2020, and a CFC focuses on common technical infrastructure for existing ESDM units. Statement 3 is incorrect because land cost is not eligible for assistance.

Q5Consider the following statements about semiconductor packaging projects mentioned in the verified corpus fact bank: 1. The Surat-based Suchi Semicon facility was approved to manufacture lead frames and wire-bond packages. 2. The Dholera project is focused on gallium nitride wafers and display panels. 3. Micron and Kaynes were described as the newly approved units in that corpus item. Which of the statements given above are correct?

A Only 1
B 1 and 2 only
C 2 and 3 only
D 1, 2 and 3
Explanation

Statements 1 and 2 are correct as per the corpus fact bank. Statement 3 is false because the corpus says Micron and Kaynes were earlier units already in commercial production, not the newly approved units in that item.

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6Consider the following statements about M-SIPS product coverage: 1. M-SIPS covered electronics products such as IT hardware, consumer electronics and medical electronics. 2. It included semiconductor chips and chip components among covered ESDM products. 3. It excluded units across the value chain such as assembly, testing and packaging. Which of the statements given above are correct?

A1 only
B2 only
C1 and 2 only
D1, 2 and 3

7Consider the following statements about the Modified Electronics Manufacturing Clusters Scheme: 1. It supports setting up both Electronics Manufacturing Clusters and Common Facility Centres. 2. A Common Facility Centre focuses on upgrading common technical infrastructure for existing ESDM units. 3. The scheme is limited to providing design-linked incentives for semiconductor start-ups. Which of the statements given above are correct?

A1 only
B1 and 2 only
C2 and 3 only
D1, 2 and 3

8Consider the following statements: 1. SPECS covers electronic components, semiconductor/display fabrication units and ATMP units. 2. Under SPECS, eligible capital expenditure includes plant, machinery, equipment and associated utilities. 3. SPECS initially allowed 5 years for filing applications. Which of the statements given above are correct?

A1 and 2 only
B2 only
C1 and 3 only
D1, 2 and 3

9Consider the following statements: 1. The original EMC Scheme was notified on 22 October 2012. 2. Under the original EMC Scheme, 19 greenfield EMCs and 3 Common Facility Centres were approved. 3. The approved project cost under the original EMC Scheme was INR 3,743 crore. 4. The approved grant-in-aid under the original EMC Scheme was INR 3,743 crore. Which of the statements given above are correct?

A1 and 2 only
B2, 3 and 4 only
C1, 2 and 3 only
D1, 2, 3 and 4

10Consider the following statements: 1. Crystal Matrix Limited's approved project is an integrated compound-semiconductor facility in Dholera, Gujarat. 2. Crystal Matrix Limited's approved facility includes manufacturing of Mini/Micro LED display modules. 3. The approved annual capacity of 72,000 square metres refers to compound-semiconductor wafers. 4. Suchi Semicon Private Limited's approved project is an OSAT facility in Surat, Gujarat. Which of the statements given above are correct?

A1 and 2 only
B2, 3 and 4 only
C1, 2 and 4 only
D1, 2, 3 and 4

11Consider the following statements: 1. For EMC projects, financial assistance is restricted to 50% of project cost subject to a ceiling of Rs. 70 crore for every 100 acres. 2. For Common Facility Centres, financial assistance is restricted to 75% of project cost subject to a ceiling of Rs. 75 crore per project. 3. Under EMC 2.0, the remaining project cost is fully borne by MeitY. Which of the statements given above are correct?

A1 only
B2 only
C3 only
D1 and 2 only

12Consider the following statements: 1. SPECS provides a financial incentive of 25% on capital expenditure. 2. SPECS is applicable only to new units and not to expansion of existing units. 3. Under SPECS, expenditure on land and building is covered as eligible capital expenditure. Which of the statements given above are correct?

A2 and 3 only
B1 and 2 only
C1 only
D1, 2 and 3

13Consider the following statements about regulatory and investment measures in electronics manufacturing: 1. FDI up to 100% under the automatic route is permitted for electronics manufacturing, subject to stated exceptions and conditions. 2. M-SIPS was approved in July 2012 to offset disability and attract investment in the ESDM sector. 3. The Compulsory Registration Order, 2012 was notified mainly to provide export subsidies for electronic goods. Which of the statements given above are correct?

AOnly 3
B1 and 3 only
C2 and 3 only
D1 and 2 only

14Consider the following statements: 1. SPECS provides 25% financial incentive on capital expenditure. 2. SPECS covers an identified list of electronic goods in the downstream value chain of electronic products. 3. SPECS excludes ATMP units from its coverage. 4. SPECS covers electronic components and semiconductor/display fabrication units. Which of the statements given above are correct?

A1, 2 and 4 only
B1 and 3 only
C2 and 4 only
D1, 2, 3 and 4

15Consider the following statements about the Tata Semiconductor Assembly and Test unit: 1. It will be set up in Morigaon, Assam. 2. It will be set up with an investment of Rs. 27,000 crore. 3. Its stated capacity is 15 million per day. Which of the statements given above are correct?

AOnly 1
B2 and 3 only
COnly 3
D1 and 2 only

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