Q1. With reference to India's first advanced 3D semiconductor packaging unit whose foundation stone was laid on 19 April 2026, consider the following statements:\n1. The plant is being set up at Info Valley in Khordha district of Odisha by a wholly owned Indian subsidiary of US-based 3D Glass Solutions Inc.\n2. The total project cost is ₹1,943.53 crore, including approved Central fiscal support of ₹799 crore under the India Semiconductor Mission.\n3. Commercial production is targeted to begin by August 2030, with full-scale output by August 2035.\nWhich of the statements given above are correct?
Explanation
Statements 1 and 2 are correct. The HIPSPL plant — set up by the Indian subsidiary of US-based 3D Glass Solutions Inc. at Info Valley, Khordha district, Odisha — has a total project cost of ₹1,943.53 crore, of which ₹799 crore is Central support under the India Semiconductor Mission. Statement 3 is incorrect: commercial production is targeted by August 2028 (not 2030), and full-scale output by August 2030 (not 2035).