Union Minister of Electronics and Information Technology Ashwini Vaishnaw on April 19, 2026 laid the foundation stone for India's first advanced 3D semiconductor packaging facility at Info Valley in Khordha district near Bhubaneswar, Odisha. The greenfield, vertically integrated advanced packaging and embedded glass substrate ATMP (Assembly, Testing, Marking and Packaging) plant is being set up by Heterogeneous Integration Packaging Solutions Pvt Ltd (HIPSPL), the wholly owned Indian subsidiary of US-based 3D Glass Solutions Inc. (3DGS). The total project cost is ₹1,943.53 crore, which includes approved Central fiscal support of ₹799 crore under the India Semiconductor Mission and additional Odisha state support of approximately ₹399.5 crore. The facility will produce 70,000 advanced glass panels annually, around 50 million assembled units and roughly 13,000 advanced 3D Heterogeneous Integration (3DHI) modules every year. It will cater to high-growth sectors such as data centres, Artificial Intelligence and Machine Learning, 5G/6G communications, automotive radar, defence electronics, aerospace applications and photonics. Commercial production is targeted to begin by August 2028, with full-scale output by August 2030. The project is expected to generate around 1,500 direct jobs and a much larger ecosystem of indirect employment in skilled manufacturing. Odisha Chief Minister Mohan Charan Majhi attended the ceremony and said the unit positions the state as a hub of next-generation chip packaging, complementing India's ongoing fabrication efforts at Dholera, Gujarat and Sanand.